EDALogic proudly introduces Atlas a comprehensive platform designed for early-stage and signoff-level thermal, power (IR), and electromigration (EM) analysis. Atlas facilitates full-spectrum, multi-physics analysis, covering electrical, thermal, signal, and power integrity. The platform consists of two distinct tools, Neo and Helius.

Neo: Chip-Level EM/IR Tool

Neo provides in-depth cross-die IR drop analysis, offering detailed insights into layout and signoff processes. It employs advanced physics-based models for electromigration (EM) and thermomigration in interposers and power grid structures. Notably, Neo mitigates pessimism inherent in heuristic-based approaches, introducing accuracy in analysis by integrating Joule heating-induced interactions.

Neo enables accurate analysis of the entire 3D package, encompassing Cu redistribution lines, micro solder bumps, through-Silicon vias, and Cu-to-Cu direct bonds.

Helius: ElectroThermal System Level Tool

In addressing widespread thermal challenges in modern 3D ICs, Helius provides a holistic approach, integrating models for both core and memory. Accurate power and current profiles of each subsystem in the entire 3D stack are incorporated.

The tool employs fine-grain and adaptive Finite Element Method (FEM) meshing strategies for detailed thermal model extraction based on local hotspot gradients. Additionally, Helius introduces a Boundary Condition independent reduced-order model extraction for core and memory modules on the chiplet, enabling fast Computational Fluid Dynamics (CFD) simulations of the entire system.

Powered by dedicated solvers and preconditioners with multi-threading and distributed processing capabilities, Helius enhances thermal simulations. The tool also offers a rapid what-if deep learning-based 3D IC thermal simulator, solving heat equations under various Partial Differential Equations (PDE) configurations.

In summary, EDALogic's Atlas platform, featuring Neo and Helius, represents a groundbreaking advancement in 3D-IC reliability analysis, offering precise, comprehensive, and efficient solutions for the challenges posed by electromigration and thermal management in modern semiconductor design.

Key characteristics

Comprehensive Reliability Platform: Atlas offers an all-in-one solution for 3D chiplet architectures, integrating advanced machine learning and simulation methodologies to perform thorough reliability analysis.

Early Detection of Hot Spots: Leveraging deep learning techniques, our platform identifies temperature hot spots that significantly impact reliability, enabling proactive measures for enhanced chiplet performance. 

Accurate Simulation Engine: With precise physics models, our simulation engine evaluates reliability under varying conditions, providing valuable insights for early design optimizations and robust chiplet architectures. 

Efficient Solution Methods: Equipped with innovative iterative methods, our numerical simulation modules accelerate analyses without compromising accuracy, streamlining the design process. 

Industry-Driven Results: Designed to meet the demands of semiconductor companies, research institutions, and diverse industries, our solution ensures optimal 3D IC reliability, empowering clients to stay ahead in a competitive market.